 |
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
|
| If you can't view the Datasheet, Please click here to try to view without PDF Reader . |
|
|
| Datasheet File OCR Text: |
| (R) STPS2L30A LOW DROP POWER SCHOTTKY RECTIFIER MAIN PRODUCT CHARACTERISTICS IF(AV) VRRM Tj (max) VF (max) FEATURES AND BENEFITS LOW COST DEVICE WITH LOW DROP FORWARD VOLTAGE FOR LESS POWER DISSIPATION. OPTIMIZED CONDUCTION/REVERSE LOSSES TRADE-OFF WHICH LEADS TO THE HIGHEST YIELD IN THE APPLICATIONS. HIGH POWER SURFACE MOUNT MINIATURE PACKAGE. DESCRIPTION Single Schottky rectifier suited to Switched Mode Power Supplies and high frequency DC to DC converters, freewheel diode and integrated circuit latch up protection. Packaged in SMA, this device is especially intended for use in parallel with MOSFETs in synchronous rectification. ABSOLUTE RATINGS (limiting values) Symbol VRRM IF(RMS) IF(AV) IFSM IRRM IRSM Tstg Tj dV/dt *: RMS forward current Average forward current Surge non repetitive forward current Repetitive peak reverse current Non repetitive peak reverse current Storage temperature range Maximum operating junction temperature * Critical rate of rise of reverse voltage TL = 120C = 0.5 tp = 10 ms Sinusoidal tp = 2 s F = 1kHz square tp = 100 s square Parameter Repetitive peak reverse voltage Value 30 10 2 75 1 1 - 65 to + 150 150 10000 Unit V A A A A A C C V/s SMA JEDEC DO-214AC 2A 30 V 150 C 0.375 V dPtot 1 < thermal runaway condition for a diode on its own heatsink Rth(j-a) dTj 1/4 August 1999 - Ed: 2A STPS2L30A THERMAL RESISTANCES Symbol Rth (j-l) Junction to lead Parameter Value 30 Unit C/W STATIC ELECTRICAL CHARACTERISTICS Symbol IR * VF * Parameters Reverse leakage current Forward voltage drop Tests Conditions Tj = 25C Tj = 100C Tj = 25C Tj = 125C Tj = 25C Tj = 125C Pulse test : * tp = 380 s, < 2% Min. Typ. 6 Max. 200 15 0.45 Unit A mA V VR = VRRM IF = 2 A IF = 4 A 0.43 0.325 0.375 0.53 0.51 To evaluate the conduction losses use the following equation : P = 0.24 x IF(AV) + 0.068 IF2(RMS) Fig. 1: Average forward power dissipation versus average forward current. 1.2 1.0 0.8 0.6 0.4 0.2 tp =tp/T IF(av) (A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 1.4 1.6 1.8 2.0 2.2 2.4 2.6 T Fig. 2: Average forward current versus ambient temperature (=0.5). 2.2 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 IF(av)(A) Rth(j-a)=Rth(j-l) PF(av)(W) = 0.1 = 0.05 = 0.2 = 0.5 =1 Rth(j-a)=120C/W T =tp/T tp Tamb(C) 50 75 100 125 150 0 25 Fig. 3: Non repetitive surge peak forward current versus overload duration (maximum values). IM(A) 10 8 6 4 2 IM t Fig. 4: Relative variation of thermal impedance junction to ambient versus pulse duration. Zth(j-a)/Rth(j-a) 1.0 0.8 Ta=25C 0.6 0.4 = 0.5 Ta=50C = 0.2 T Ta=100C =0.5 0.2 = 0.1 Single pulse t(s) 1E-2 1E-1 1E+0 tp(s) 1E+0 1E+1 =tp/T tp 0 1E-3 0.0 1E-2 1E-1 1E+2 5E+2 2/4 STPS2L30A Fig. 5: Reverse leakage current versus reverse voltage applied (typical values). IR(mA) 1E+2 Tj=150C Fig. 6: Junction capacitance versus reverse voltage applied (typical values). C(pF) 500 F=1MHz Tj=25C 1E+1 1E+0 1E-1 1E-2 1E-3 0 5 Tj=125C Tj=100C 100 Tj=25C VR(V) 10 15 20 25 30 VR(V) 10 1 2 5 10 20 30 Fig. 7-1: Forward voltage drop versus forward current (maximum values, high level). 10.00 IFM(A) Fig. 7-2: Forward voltage drop versus forward current (typical values, low level). 10.00 IFM(A) Tj=125C Typical values Tj=150C Tj=150C 1.00 Tj=25C Tj=125C Tj=25C 1.00 0.10 Tj=100C VFM(V) 0.01 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 VFM(V) 0.10 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 Fig. 7-3: Forward voltage drop versus forward current (maximum values, low level). Fig. 8: Thermal resistance junction to ambient versus copper surface under each lead (Epoxy printed circuit board FR4, copper thickness: Rth(j-a) (C/W) IFM(A) 3.0 Typical values Tj=150C 140 Tj=25C 2.5 Tj=125C 120 100 2.0 1.5 1.0 0.5 Tj=100C 80 60 40 20 0 S(Cu) (cm) 0 1 2 3 4 5 VFM(V) 0.0 0.10 0.15 0.20 0.25 0.30 0.35 0.40 0.45 0.50 0.55 0.60 3/4 STPS2L30A PACKAGE MECHANICAL DATA SMA DIMENSIONS E1 REF. Millimeters Min. Max. 2.70 0.20 1.65 0.41 5.60 4.60 2.95 1.60 Inches Min. 0.075 0.002 0.049 0.006 0.189 0.156 0.089 0.030 Max. 0.106 0.008 0.065 0.016 0.220 0.181 0.116 0.063 D A1 A2 b 1.90 0.05 1.25 0.15 4.80 3.95 2.25 0.75 E c A1 E E1 b C L A2 D L FOOT PRINT DIMENSIONS (in millimeters) 1.65 1.45 Ordering type STPS2L30A 2.40 1.45 Package SMA Weight 0.068g Base qty 5000 Delivery mode Tape & reel Marking G30 Band indicates cathode Epoxy meets UL94,V0 Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written approval of STMicroelectronics. The ST logo is a registered trademark of STMicroelectronics (c) 1999 STMicroelectronics - Printed in Italy - All rights reserved. STMicroelectronics GROUP OF COMPANIES Australia - Brazil - China - Finland - France - Germany - Hong Kong - India - Italy - Japan - Malaysia Malta - Morocco - Singapore - Spain - Sweden - Switzerland - United Kingdom - U.S.A. http://www.st.com 4/4 |
Price & Availability of STPS2L30A
 |
|
|
|
|
All Rights Reserved © IC-ON-LINE 2003 - 2022 |
| [Add Bookmark] [Contact Us] [Link exchange] [Privacy policy] |
|
Mirror Sites : [www.datasheet.hk]
[www.maxim4u.com] [www.ic-on-line.cn]
[www.ic-on-line.com] [www.ic-on-line.net]
[www.alldatasheet.com.cn]
[www.gdcy.com]
[www.gdcy.net] |